What is C12000 copper?
TP1/C12000 phosphorus-deoxidized copper alloy is a high-purity copper alloy containing phosphorus for deoxidation, primarily used in the power, electrical, electronic, and communications industries. Due to its excellent electrical and thermal conductivity and corrosion resistance, TP1 phosphorus-deoxidized copper alloy is widely used in the manufacture of various electrical components, heat exchangers, and other industrial equipment.
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The main components of TP1 phosphorus-deoxidized copper alloy are as follows:
Copper (Cu): Balance
Phosphorus (P): 0.015% - 0.040%
Other impurities such as lead (Pb), iron (Fe), and antimony (Sb) generally do not exceed 0.05% in total to ensure its high purity.
Physical Properties
|
Property |
Value |
|
Density (g/cm³) |
8.94 |
|
Melting Point (°C) |
1083 |
|
Electrical Conductivity (%IACS) |
98 – 100 |
|
Thermal Conductivity (W/m·K) |
391 (at 20°C) |
Mechanical Properties
|
Condition |
Tensile Strength (MPa) |
Yield Strength (MPa) |
Elongation (%) |
Hardness (HV) |
|
Annealed |
200 – 250 |
50 – 80 |
45 – 55 |
40 – 60 |
|
Hard |
300 – 350 |
250 – 300 |
10 – 20 |
80 – 100 |
Equivalents of UNS C12000 Copper
| Standard | Designation | Name / Description | Key Similarities |
|---|---|---|---|
| UNS (USA) | C12000 | Phosphorus Deoxidized, Low Residual Phosphorus (DLP) | Base Standard |
| ASTM (USA) | B152, B124 | C12000 | |
| CDA (USA) | 120 | - | Industry Standard |
| ISO | Cu-DLP | Copper - DLP (Chemical Symbol) | Closest ISO Chemical Designation |
| EN (Europe) | Cu-DLP (EN 1412) CW024A (EN 13599) |
Copper - DLP | Chemical Composition Equivalent |
| JIS (Japan) | C1201 | Phosphorus Deoxidized Copper | Nearly Identical |
| GB (China) | TP1 (Old: T2P) | Phosphorus Deoxidized Copper | Note: TP1 is generally considered the closest match, though phosphorus content may differ slightly. |
| DIN (Germany) | SF-Cu (DIN 1708) | Deoxidized Copper with Low Residual Phosphorus | |
| BS (UK) | C106 | Phosphorus Deoxidized Copper for General Purposes |
Application Areas
Heat Exchange Systems: Condensers, evaporators, heat exchanger fittings, suitable for air conditioning and HVAC systems.
Fluid Transportation: Gasoline/gas transmission pipes, drainage pipes, mine casing pipes, and other corrosion-resistant applications.
Electrical and Mechanical: Electrical connectors, conductive components, heat dissipation components, and train car parts.
Machining and Heat Treatment of TP1 Phosphorus Deoxidized Copper Alloy
1. Machining Performance
TP1 phosphorus deoxidized copper alloy exhibits excellent cold working properties, allowing for various machining processes such as wire drawing, stamping, and bending. Its superior ductility enables the machining of complex shapes without annealing.
2. Heat Treatment
Annealing TP1 phosphorus deoxidized copper alloy within a temperature range of 400°C to 600°C effectively eliminates work hardening and improves the material's ductility and toughness.
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Dimensional Range Table
In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.
Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.
Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.
Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.
The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.
| Nominal Size (inches) | Type K | Type L | Type M |
|---|---|---|---|
| Outside Diameter (OD) | Same for all types | ||
| Wall Thickness | Thickest | Medium | Thinnest |
| Inside Diameter (ID) | Smallest | Medium | Largest |
| 1/2" | OD: 0.625" ID: 0.527" Wall: 0.049" |
OD: 0.625" ID: 0.545" Wall: 0.040" |
OD: 0.625" ID: 0.569" Wall: 0.028" |
| 3/4" | OD: 0.875" ID: 0.745" Wall: 0.065" |
OD: 0.875" ID: 0.785" Wall: 0.045" |
OD: 0.875" ID: 0.811" Wall: 0.032" |
| 1" | OD: 1.125" ID: 0.995" Wall: 0.065" |
OD: 1.125" ID: 1.025" Wall: 0.050" |
OD: 1.125" ID: 1.055" Wall: 0.035" |
Our factory
Our factory is built for precision and scale in producing copper rods, tubes, plates, bars, wires, and strips. We operate advanced equipment such as upward continuous casting systems for oxygen-free copper rods, CNC-controlled pilger mills for seamless tubes, and automated strip rolling lines with real-time thickness monitoring. All products are manufactured to meet ASTM, DIN, and customer-specific standards, with process control at every stage. Our quality assurance includes metallographic analysis, conductivity testing, and surface quality inspection via optical comparators. From raw material to finished product, we ensure consistency, performance, and on-time delivery for industrial and OEM partners globally.
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Copper product packaging
Our copper product packaging always prioritizes safety protection and professional identification. Copper rods and profiles are securely bundled with steel straps and fixed on reinforced wooden pallets, with waterproof and moisture-proof film wrapped around the exterior. Copper tubes are equipped with protective caps on both ends and packaged in custom-designed cartons or wooden crates with internal cushioning materials. Copper plates and strips are interleaved with anti-rust paper and fully encapsulated in steel-edged crates. All packages are affixed with clear product labels, specifications, and moisture-proof tags. For high-purity copper materials or those with special application requirements (such as oxygen-free copper wires and high-end copper strips), we also offer professional nitrogen-filled sealed packaging to ensure complete oxygen isolation during transportation and storage, preventing oxidation and maintaining the optimal performance and surface condition of the materials.
