Jan 08, 2026 Leave a message

Chemical Composition Of TP1 Phosphorus-Deoxidized Copper

What is C12000 copper?

C12000 phosphorus-deoxidized copper is a copper alloy with good electrical and thermal conductivity and weldability, widely used in the electronics, communications, and power industries. Its low residual phosphorus content gives it superior electrical and thermal conductivity compared to other types of phosphorus-deoxidized copper, such as TP2. Due to its unique physical and chemical properties, TP1 copper materials offer many unique application advantages.

 

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Chemical Composition of TP1 Phosphorus-Deoxidized Copper:

Copper (Cu): Balance

Copper is the main component of TP1. As an excellent electrical and thermal conductor, copper provides TP1 with superior electrical and thermal properties.

Phosphorus (P): 0.005%–0.012%

Phosphorus is the deoxidizer in TP1 phosphorus-deoxidized copper. Its content is controlled within a certain range to help reduce the oxygen content in copper and prevent the formation of oxides in the copper alloy. Compared with TP2, TP1 has a lower phosphorus content, which gives TP1 better electrical and thermal conductivity.

Tin (Sn): ≤0.002%

Tin content is extremely low. Its main function is to prevent oxidation and maintain the stability of the alloy, especially in high-temperature and humid environments.

Zinc (Zn): ≤0.005%

Zinc content is extremely low and usually exists as an impurity. The addition of small amounts of zinc will not significantly affect the conductivity of the material.

Lead (Pb): ≤0.005%

Lead is another impurity present in extremely low amounts, and its presence usually does not significantly affect the performance of TP1.

Iron (Fe): ≤0.01%

Iron is a common impurity in copper alloys. Excessive iron can affect the conductivity and mechanical properties of the material; therefore, the iron content in TP1 copper is strictly controlled.

Antimony (Sb): ≤0.002%

Antimony is present in extremely low amounts in copper, and its impact on the alloy's properties is negligible.

Sulfur (S): ≤0.005%

Sulfur also exists as an impurity. Excessive sulfur may affect weldability, but the sulfur content in TP1 copper is strictly controlled.

Arsenic (As): ≤0.002%

Arsenic has a certain negative impact on the conductivity and corrosion resistance of copper alloys; therefore, its content is also limited.

Bismuth (Bi): ≤0.002%

Bismuth is another trace impurity in copper alloys, with its content controlled below 0.002%.

Oxygen (O): ≤0.01%

TP1 copper has a low oxygen content, which helps to improve its conductivity and extend its service life.

 

Mechanical Properties

Properties Metric Imperial
Tensile strength, ultimate 221 - 393 MPa 32100 - 57000 psi
Tensile strength, yield (depending on temper) 69.0 - 365 MPa 10000 - 52900 psi
Elongation at break ( in 101.6 mm (4 in.)) 55% 55%
Machinability (UNS C36000 (free-cutting brass) = 100%) 20% 20%
Poisson's ratio 0.34 0.34
Elastic modulus 117 GPa 16970 ksi

 

Fabrication and Heat Treatment

Machinability

The machinability rate of UNS C12000 copper is 20%

Welding

Brazing, gas shielded arc welding, oxyacetylene welding, soldering, and butt welding are the methods used for welding UNS C12000 copper. It is suggested that seam welding, coated metal arc welding, and spot welding are not used for welding this alloy.

Forging

Forging of UNS C12000 copper can be performed at a temperature of about 760 to 871°C (1400 to 1600°F). This alloy has good forgeability.

Hot Working

UNS C12000 copper has excellent hot working capacity.

Cold Working

UNS C12000 copper has good excellent cold working capacity.

Annealing

Annealing of UNS C12000 copper can be performed at 372 to 649°C (700 to 1200°F).

 

Equivalents of UNS C12000 Copper

Standard Designation Name / Description Key Similarities
UNS (USA) C12000 Phosphorus Deoxidized, Low Residual Phosphorus (DLP) Base Standard
ASTM (USA) B152, B124 C12000  
CDA (USA) 120 - Industry Standard
ISO Cu-DLP Copper - DLP (Chemical Symbol) Closest ISO Chemical Designation
EN (Europe) Cu-DLP (EN 1412)
CW024A (EN 13599)
Copper - DLP Chemical Composition Equivalent
JIS (Japan) C1201 Phosphorus Deoxidized Copper Nearly Identical
GB (China) TP1 Phosphorus Deoxidized Copper Note: TP1 is generally considered the closest match, though phosphorus content may differ slightly.
DIN (Germany) SF-Cu (DIN 1708) Deoxidized Copper with Low Residual Phosphorus  
BS (UK) C106 Phosphorus Deoxidized Copper for General Purposes  

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Dimensional Range Table

In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.

Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.

Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.

Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.

The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.

Nominal Size (inches) Type K Type L Type M
Outside Diameter (OD) Same for all types    
Wall Thickness Thickest Medium Thinnest
Inside Diameter (ID) Smallest Medium Largest
1/2" OD: 0.625"
ID: 0.527"
Wall: 0.049"
OD: 0.625"
ID: 0.545"
Wall: 0.040"
OD: 0.625"
ID: 0.569"
Wall: 0.028"
3/4" OD: 0.875"
ID: 0.745"
Wall: 0.065"
OD: 0.875"
ID: 0.785"
Wall: 0.045"
OD: 0.875"
ID: 0.811"
Wall: 0.032"
1" OD: 1.125"
ID: 0.995"
Wall: 0.065"
OD: 1.125"
ID: 1.025"
Wall: 0.050"
OD: 1.125"
ID: 1.055"
Wall: 0.035"

 

 

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