Mar 13, 2026 Leave a message

C10100 Copper for Sputtering Targets

In semiconductor thin-film deposition, your sputtering target is only as reliable as the backplate supporting it. Whether you are using gold, silver, or ceramic target materials, the backplate must act as a perfect heat sink and a vacuum-stable foundation.

For high-power Physical Vapor Deposition (PVD), C10100 Oxygen-Free Electronic copper is the industry mandate. Anything less than 99.99% purity introduces catastrophic variables into the cleanroom-specifically localized overheating and chamber contamination.

 

Thermal Management: Preventing Target Cracking

Sputtering is a high-energy process that generates immense heat. If the backplate cannot dissipate this thermal load instantly, the bonding interface between the target and the plate will fail, or worse, the target itself will crack.

Our C10100 Plate, Sheet provides a thermal conductivity of approximately 391 W/m-K. With a guaranteed 101% IACS conductivity, C10100 ensures a uniform thermal gradient across the entire target surface. This prevents "hot spots" that cause non-uniform film thickness on the silicon wafer-a defect that can cost semiconductor fabs tens of thousands of dollars per batch.

 

Vacuum Integrity: Eliminating Outgassing in PVD Chambers

The PVD process operates under ultra-high vacuum (UHV) conditions. At these pressures, even trace amounts of volatile impurities in the copper (like Zinc, Lead, or high oxygen levels) will "outgas."

Because GNEE METAL's C10100 contains Max 5ppm oxygen, it is virtually inert in a vacuum. Unlike standard ETP copper, which contains Cuprous Oxide (Cu2O) inclusions, our OFE grade ensures that no trapped gases are released to contaminate the plasma or the deposited thin film.

 

Diffusion Bonding and CNC Precision

Most sputtering targets are bonded to the C10100 backplate via diffusion bonding or soldering. The success of this bond depends on the surface's chemical purity and flatness.

Zero Inclusions: The absence of oxides in C10100 ensures a stronger, more consistent bond at the molecular level.

Precision Machining: For custom target geometries,Custom CNC Machined Parts made from C10100 offer superior dimensional stability. The material's high ductility allows for complex cooling channel integration within the backplate without risk of stress corrosion cracking.

If your design requires circular geometries, we also supply C10100 Round, Square & Flat Bar specifically forged for target backing discs, ensuring a fine grain structure that promotes uniform sputtering rates.

 

Download C10100 Thermal & Mechanical Data Sheet for PVD Design

 

Meeting the ASTM F68 Standard for Electronics

Not all "4N" (99.99%) copper is equal. For semiconductor applications, we certify our material to ASTM F68 and ASTM B170 Grade 1 specifications. This ensures that the grain size and metallurgical cleanliness meet the "Electronic Grade" requirements that standard industrial copper (even C10200) cannot match.

By choosing C10100, you are not just buying metal; you are securing the yield of your thin-film deposition process. Whether you are sourcing C10100 Foil for vapor barriers or heavy plates for cathode assemblies, GNEE METAL provides the traceability required for Tier-1 semiconductor supply chains.

Request a Quote for Semiconductor-Grade C10100 Backplates

 

GNEE METAL Product Range

Product Type Shapes Available Common Grades Diameter/Thickness Range Length/Width Range Applications
Copper Tubes Round, Square, Rectangular, Coiled C10100, C10200, C11000, C12200, C12000 OD: 0.5mm - 300mm Wall: 0.1mm - 20mm Up to 6000mm or custom HVAC, Plumbing, Heat Exchangers, Refrigeration, Hydraulic Lines
Copper Plates & Sheets Flat Sheets, Perforated, Embossed, Tread Plate C10100, C11000, C12200, C23000, C26000 Thickness: 0.1mm - 200mm Width: Up to 2500mm Length: Up to 6000mm Electrical Busbars, Roofing, Cladding, Gaskets, Transformers
Copper Bars & Rods Round Bar, Square Bar, Hexagonal Bar, Flat Bar C10100, C11000, C14500, C17200, C18200 Diameter: 1mm - 300mm Length: 1000mm - 4000mm Machined Components, Electrical Contacts, Busbars, Fasteners
Copper Wires Round Wire, Flat Wire, Square Wire, Stranded, Braided C11000, C11600, C17200, C17510 Diameter: 0.05mm - 12mm Coil weights: 1kg - 500kg Electrical Wiring, Cables, Springs, Mesh, Welding Wire
Copper Strips & Coils Thin Strip, Foil, Slit Coil, Profile Strip C11000, C12200, C19400, C26000, C26800 Thickness: 0.03mm - 5mm Width: 2mm - 1000mm Coil ID: 300mm - 600mm Transformers, Radiators, Shielding, Terminals, Connectors

 

About Our Factory

We operate a full range of production lines including extrusion presses, cold drawing benches, high-speed rolling mills, slitting lines, and precision CNC machining centers, enabling us to produce copper tubes, plates, bars, wires, and strips entirely in-house. For quality assurance, we maintain a dedicated inspection laboratory equipped with spectral analyzers, universal testing machines, hardness testers, surface roughness testers, and optical measuring instruments. Every batch is tested for chemical composition, mechanical properties, and dimensional accuracy before shipment. Our production capacity reaches 500+ tons per month, and we hold ISO 9001:2015 certification with full traceability from raw material to finished product. Whether you need standard mill stock or custom-processed components, we deliver precision copper products with short lead times and complete material certification.

C10100 Oxygen Free Electronic Copper (CDA 101)

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