Material Characteristics
Conductivity & Thermal Conductivity：Due to its low residual phosphorus content (0.004–0.012%), TP1 exhibits significantly superior electrical and thermal conductivity compared to TP2, with a copper purity of over 99.9%.
Composition & Mechanical Properties：
Composition：Cu+Ag ≥ 99.85%, phosphorus (P) content 0.013–0.050%, with trace silver to enhance purity.
Tensile Strength：200–360 MPa, elongation ≥ 20%, hardness HV 40–110, offering a balance of strength and ductility.
Processing Properties：
TP1 demonstrates excellent weldability and cold-bending performance, with no tendency toward "hydrogen embrittlement." However, processing should be conducted in a reducing atmosphere to avoid oxidation.
We provide TP1/C12000 copper pipes
Heat Exchange Systems：Condensers, evaporators, and heat exchanger pipes, suitable for HVAC systems.
Fluid Transport：Gasoline/gas transfer pipes, drainage pipes, naval mine tubes, and other corrosion-resistant applications.
Electrical & Mechanical：Electrical connectors, conductive components, heat dissipation parts, and railway carriage components.
Copper TP1 Equivalent Designation
| Standard / Country | Equivalent Designation | Notes / Grade Name |
|---|---|---|
| China (GB/T) | TU1 (Primary Standard) | Premium Oxygen-Free Copper (Oxygen ≤ 0.0005%) |
| China (GB/T) | TP1 (Commonly used name) | Same as TU1 in practice |
| ISO | Cu-OF | Oxygen-Free Copper (High Conductivity) |
| ASTM (USA) | C10100 / C10200 | Oxygen-Free Electronic (OFE) Copper |
| EN (Europe) | Cu-OF1 (CW009A) | Oxygen-Free Copper, ≥ 99.99% Cu |
| JIS (Japan) | C1011 | Oxygen-Free Copper |
| DIN (Germany) | OF-Cu (2.0070) | Oxygen-Free Copper |
| Common Name | OFE Copper (Oxygen-Free Electronic) | Highest purity grade for electronic applications |
Comparison of Copper TP1 vs. TP2
| Feature | Copper TP1 (C1020) | Copper TP2 (C1100) | Key Takeaway |
|---|---|---|---|
| GB/T Standard | TU1 (Premium Oxygen-Free Copper) | TU2 (Standard Oxygen-Free Copper) | TP1 meets a higher-grade standard. |
| Oxygen Content | ≤ 0.0005% (Extremely Low) | ≤ 0.001% (Very Low) | Fundamental Difference: TP1 is True OFC, TP2 is Low-Oxygen Copper. |
| Purity (Cu+Ag) | ≥ 99.99% | ≥ 99.95% | TP1 has slightly higher purity. |
| Primary Property | Exceptional conductivity & thermal conductivity. Superior resistance to hydrogen embrittlement. | Excellent conductivity & thermal conductivity. Very good workability and weldability. | Conductivity difference is minimal for most uses. TP1 excels in specific harsh conditions. |
| Hydrogen Embrittlement | Excellent resistance. Safe in reducing atmospheres (e.g., hydrogen). | Good resistance, but can be susceptible in high-temp/high-pressure hydrogen environments. | The Critical Selection Factor. For processes involving high-temperature reducing atmospheres, TP1 is mandatory. |
| Common Applications | High-vacuum electronic tubes, semiconductor sputtering targets, critical high-temperature conductors. | Power cables, busbars, waveguides, transformer strips, general pipes, heat exchangers. | TP1 for high-end, critical apps. TP2 for general-purpose electrical/thermal applications. |
| Cost | Higher | Lower, more economical | TP2 offers better cost-effectiveness for standard applications. |
| Availability | Sheet, strip, tube, bar, wire. | Sheet, strip, tube, bar, wire (more widely available commercially). | TP2 is generally easier to source in various forms. |
How to Choose: Quick Guide
Choose Copper TP1 when:
The application involves high-temperature reducing atmospheres (e.g., annealing in hydrogen).
Used in ultra-high vacuum environments (e.g., klystrons, accelerator cavities).
For the most critical semiconductor components (e.g., high-purity targets).
Maximum resistance to hydrogen-induced failure is the top priority.
Choose Copper TP2 when:
For general electrical conduction (busbars, windings, cables).
For standard heat exchangers, plumbing, and piping.
Good weldability and formability are needed at a lower cost.
The environment does not pose a hydrogen embrittlement risk.
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Dimensional Range Table
In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.
Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.
Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.
Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.
The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.
| Nominal Size (inches) | Type K | Type L | Type M |
|---|---|---|---|
| Outside Diameter (OD) | Same for all types | ||
| Wall Thickness | Thickest | Medium | Thinnest |
| Inside Diameter (ID) | Smallest | Medium | Largest |
| 1/2" | OD: 0.625" ID: 0.527" Wall: 0.049" |
OD: 0.625" ID: 0.545" Wall: 0.040" |
OD: 0.625" ID: 0.569" Wall: 0.028" |
| 3/4" | OD: 0.875" ID: 0.745" Wall: 0.065" |
OD: 0.875" ID: 0.785" Wall: 0.045" |
OD: 0.875" ID: 0.811" Wall: 0.032" |
| 1" | OD: 1.125" ID: 0.995" Wall: 0.065" |
OD: 1.125" ID: 1.025" Wall: 0.050" |
OD: 1.125" ID: 1.055" Wall: 0.035" |
Our product range
| Product Category | Key Product Forms | Common Standards (Examples) | Typical Applications / Features |
|---|---|---|---|
| Copper Rods & Bars | Round Rods, Square Bars, Hexagonal Bars | ASTM B187, C11000, C10200; EN 12163-66; JIS H3250 | Electrical conductors, machined parts, connectors, hardware. Available in various tempers (soft, hard). |
| Copper Tubes & Pipes | Seamless Tubes, Straight Lengths, Coils (for flexible tubes) | ASTM B75, B280, B88; EN 12735; JIS H3300 | Plumbing, HVAC/R, heat exchangers, medical gas lines, hydraulic systems. |
| Copper Plates & Sheets | Plates (>6mm thickness), Sheets (<6mm thickness) | ASTM B152, C11000; EN 1652; JIS H3100 | Architectural cladding, industrial fabrication, grounding plates, chemical processing. |
| Copper Strips & Foils | Strips, Rolls, Precision Foils | ASTM B272, C11000; EN 1652; JIS H3100 | Electrical contacts, transformers, shielding, gaskets, decorative inlays. |
| Copper Wires | Bare Copper Wire, Stranded Wire, Busbars | ASTM B1, B3, B187; EN 13601; JIS H3260 | Windings, cables, busbars, fasteners, welding electrodes. |
Our factory
Our factory is built for precision and scale in producing copper rods, tubes, plates, bars, wires, and strips. We operate advanced equipment such as upward continuous casting systems for oxygen-free copper rods, CNC-controlled pilger mills for seamless tubes, and automated strip rolling lines with real-time thickness monitoring. All products are manufactured to meet ASTM, DIN, and customer-specific standards, with process control at every stage. Our quality assurance includes metallographic analysis, conductivity testing, and surface quality inspection via optical comparators. From raw material to finished product, we ensure consistency, performance, and on-time delivery for industrial and OEM partners globally.
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