What is C12000 copper?
TP1/C12000 is a copper material characterized by refined phosphorus and trace amounts of residual phosphorus. Because phosphorus significantly affects the electrical conductivity of copper, TP1 is typically used as a structural material rather than a conductor. Under normal conditions, it does not exhibit hydrogen embrittlement, but high-temperature oxidation conditions should be avoided when processing and using it in reducing atmospheres. TP1 has good weldability and cold bending properties, generally does not suffer from hydrogen embrittlement, and can be processed and used in reducing atmospheres, but processing and use in oxidizing atmospheres are not recommended. Due to its low residual phosphorus content, TP1 has high electrical and thermal conductivity. It is mainly used as tubing, but is also available in plates, strips, bars, and wires. Applications of TP1 include gasoline or gas transmission pipes, drainage pipes, condenser pipes, condensers, evaporators, heat exchangers, and train car parts.
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TP1 Copper Tube Characteristics and Applications
TP1 copper tubes, made from TP1 copper, possess all the advantages of TP1 copper. Furthermore, due to its unique tubular structure, TP1 copper tubes are widely used in heat exchangers and air conditioning systems, where their excellent thermal conductivity effectively improves system efficiency. Meanwhile, the corrosion resistance of TP1 copper pipes ensures the long-term stable operation of the system and reduces maintenance costs.
Compared to other types of copper pipes, such as T2 copper pipes, TP1 copper pipes have significant advantages in weldability and corrosion resistance. This is mainly due to their unique phosphorus deoxidation process, which greatly improves their weldability and corrosion resistance while maintaining high conductivity.
Chemical Composition
Copper+Silver With Ag: | Tin Sn: | Zinc Zn: | Lead Pb: | Nickel It is: | Iron Fe: |
≥ 99.90 | ≤ 0.002 | ≤ 0.005 | ≤ 0.005 | ≤ 0.005 | ≤ 0.01 |
Antimony Sb: | Sulphur S: | Arsenic As: | Bismuth Bi: | Oxygen O: | Phosphorus P: |
≤ 0.002 | ≤ 0.005 | ≤ 0.002 | ≤ 0.002 | ≤ 0.01 | 0.005～0.012 |
Mechanical Properties
Tensile Strength Kb (MPa): | Elongation D10 (%): | Hardness: |
245～345 | ≥ 8 | 75～120HV |
Processing Considerations
Forming: Requires annealing for cold-worked products.
Welding: Use TIG or resistance welding; avoid overheating.
Machining: Low tool wear due to softness; use sharp tools.
Cleaning: Remove oxides with non-abrasive agents.
C12000 vs C10200
| Feature | UNS C12000 | UNS C10200 |
|---|---|---|
| Common Name | Phosphorus Deoxidized, Low Residual P (DLP) | Oxygen-Free Copper (OF) |
| Key Composition | Cu ≥99.90%, P: 0.004-0.012% | Cu ≥99.95%, O ≤0.0005% |
| Oxygen Content | Very Low | Extremely Low (Virtually Zero) |
| Deoxidizer | Phosphorus | None (Process-controlled) |
| Electrical Conductivity | Very High (~100% IACS) | Highest (~101%+ IACS) |
| Thermal Conductivity | Very High | Slightly Higher |
| Formability & Ductility | Excellent | Superior (especially in annealed state) |
| Weldability & Brazability | Excellent (due to P deoxidation) | Excellent (requires inert atmosphere) |
| Resistance to Hydrogen Embrittlement | Poor (in reducing atmospheres) | Very Good (no Cu₂O to react) |
| Typical Applications | High-conductivity busbars, heat exchangers, tubing | High-vacuum electronics, glass-metal seals, waveguides, sputtering targets |
Choose C10200 (Oxygen-Free Copper) when your priority is:
Maximum Purity & Conductivity: For critical electrical/electronic components (e.g., waveguides, semiconductor parts).
High-Temperature in Hydrogen: For service in reducing atmospheres (e.g., hydrogen furnaces, brazing atmospheres) where hydrogen embrittlement is a risk.
Superior Ductility & Forming: For severe cold working and deep drawing applications.
High-Vacuum or Sealing Applications: Where outgassing or oxidation at high temperatures must be absolutely minimized (e.g., glass-metal seals, accelerator parts).
Choose C12000 (Phosphorus Deoxidized Copper) when your priority is:
Excellent Conductivity at Lower Cost: For high-performance busbars, electrical conductors, and heat exchangers where C10200's marginal gain isn't justified.
Easier Joining in Air: Its deoxidized nature makes it very forgiving for welding and brazing in standard shop environments.
General High-Conductivity Applications: Where hydrogen embrittlement is not a concern (e.g., standard electrical components, non-reducing atmosphere heat transfer).
Good Balance of Performance and Practical Fabrication.
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Dimensional Range Table
In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.
Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.
Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.
Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.
The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.
| Nominal Size (inches) | Type K | Type L | Type M |
|---|---|---|---|
| Outside Diameter (OD) | Same for all types | ||
| Wall Thickness | Thickest | Medium | Thinnest |
| Inside Diameter (ID) | Smallest | Medium | Largest |
| 1/2" | OD: 0.625" ID: 0.527" Wall: 0.049" | OD: 0.625" ID: 0.545" Wall: 0.040" | OD: 0.625" ID: 0.569" Wall: 0.028" |
| 3/4" | OD: 0.875" ID: 0.745" Wall: 0.065" | OD: 0.875" ID: 0.785" Wall: 0.045" | OD: 0.875" ID: 0.811" Wall: 0.032" |
| 1" | OD: 1.125" ID: 0.995" Wall: 0.065" | OD: 1.125" ID: 1.025" Wall: 0.050" | OD: 1.125" ID: 1.055" Wall: 0.035" |
Our factory
Our factory is built for precision and scale in producing copper rods, tubes, plates, bars, wires, and strips. We operate advanced equipment such as upward continuous casting systems for oxygen-free copper rods, CNC-controlled pilger mills for seamless tubes, and automated strip rolling lines with real-time thickness monitoring. All products are manufactured to meet ASTM, DIN, and customer-specific standards, with process control at every stage. Our quality assurance includes metallographic analysis, conductivity testing, and surface quality inspection via optical comparators. From raw material to finished product, we ensure consistency, performance, and on-time delivery for industrial and OEM partners globally.
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Copper product packaging
Our copper product packaging always prioritizes safety protection and professional identification. Copper rods and profiles are securely bundled with steel straps and fixed on reinforced wooden pallets, with waterproof and moisture-proof film wrapped around the exterior. Copper tubes are equipped with protective caps on both ends and packaged in custom-designed cartons or wooden crates with internal cushioning materials. Copper plates and strips are interleaved with anti-rust paper and fully encapsulated in steel-edged crates. All packages are affixed with clear product labels, specifications, and moisture-proof tags. For high-purity copper materials or those with special application requirements (such as oxygen-free copper wires and high-end copper strips), we also offer professional nitrogen-filled sealed packaging to ensure complete oxygen isolation during transportation and storage, preventing oxidation and maintaining the optimal performance and surface condition of the materials.
