What is C12000 copper?
Pure copper has high electrical and thermal conductivity. Alloys can be freely formed by copper. UNS C12000 copper has 95% IACS conductivity, low residual phosphorus, and high embrittlement resistance. It is available in the form of rod, tube, and wire.
We provide TP1/C12000 copper pipes
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Common Specifications
ASTM: B42, B68, B75, B88, B111, B188, B280, B360, B372, B447, B743
SAE: J528
Military Specification: MIL-T-24107B
JIS Standard: H3300
Industry Applications
Thermal Applications
Cooling systems
Heat-sink components
Chemical processing
Aerospace
Defense
Electrical Applications
Conductors
Connectors
Terminals
High-frequency RF components
Industrial Uses
Precision instrumentation
ASTM B88 UNS C12000 Chemical Composition
| Element | Composition (%) |
|---|---|
| Copper (Cu) | ≥ 99.90 |
| Phosphorus (P) | 0.015 – 0.040 |
| Other Elements | ≤ 0.05 |
UNS C12000 Mechanical Properties
| Property | Value |
|---|---|
| Tensile Strength | 210 – 250 MPa |
| Yield Strength | 70 – 95 MPa |
| Elongation | ≥ 40% |
| Hardness | 40 – 85 HB |
UNS C12000 Physical Properties
| Property | Value |
|---|---|
| Density | 8.94 g/cm³ |
| Melting Point | ~1083°C |
| Thermal Conductivity | 330 – 340 W/m·K |
| Electrical Conductivity | ~85 – 90% IACS |
| Coefficient of Thermal Expansion | 16.5 µm/m·°C |
C12000 vs C11000
| Feature | UNS C12000 | UNS C11000 (ETP Copper) |
|---|---|---|
| Common Name | Phosphorus Deoxidized, Low P (DLP) | Electrolytic Tough Pitch Copper |
| Key Composition | Cu ≥99.90%, P added (0.004-0.012%) | Cu ≥99.90%, Oxygen present (0.02-0.04%) |
| Oxygen Content | Very Low | Intentional (~0.03%) |
| Electrical Conductivity | Very High (~100% IACS) | The Reference Standard (101% IACS) |
| Thermal Conductivity | Very High | Very High |
| Formability & Ductility | Excellent | Excellent |
| Weldability & Brazability | Excellent | Poor / Not Recommended |
| Resistance to Hydrogen Embrittlement | Poor (in reducing atmospheres) | Very Poor ("Hydrogen Disease") |
| Workability at High Temp | Good | Poor (Hot Shortness) |
| Typical Applications | Busbars, tubing, heat exchangers | Electrical wire, cable, non-welded components |
Choose C11000 (ETP Copper) when:
Your application is simple electrical conductivity (e.g., wire, cable, non-welded busbars, windings).
You require the absolute lowest cost for a high-conductivity copper.
The part will NOT be welded, brazed, or heated above 370°C in service or fabrication.
It will never be exposed to reducing atmospheres (e.g., hydrogen, carbon monoxide).
Choose C12000 (DLP Copper) when:
The component requires any form of welding or high-temperature brazing.
You need good hot workability (forging, hot forming) without "hot shortness."
You are fabricating a complex assembly where joining is necessary, but still require near-maximum conductivity.
Your application involves heated parts, even if not joined (safer against hydrogen embrittlement than C11000).
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Dimensional Range Table
In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.
Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.
Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.
Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.
The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.
| Nominal Size (inches) | Type K | Type L | Type M |
|---|---|---|---|
| Outside Diameter (OD) | Same for all types | ||
| Wall Thickness | Thickest | Medium | Thinnest |
| Inside Diameter (ID) | Smallest | Medium | Largest |
| 1/2" | OD: 0.625" ID: 0.527" Wall: 0.049" |
OD: 0.625" ID: 0.545" Wall: 0.040" |
OD: 0.625" ID: 0.569" Wall: 0.028" |
| 3/4" | OD: 0.875" ID: 0.745" Wall: 0.065" |
OD: 0.875" ID: 0.785" Wall: 0.045" |
OD: 0.875" ID: 0.811" Wall: 0.032" |
| 1" | OD: 1.125" ID: 0.995" Wall: 0.065" |
OD: 1.125" ID: 1.025" Wall: 0.050" |
OD: 1.125" ID: 1.055" Wall: 0.035" |
Our factory
Our factory is built for precision and scale in producing copper rods, tubes, plates, bars, wires, and strips. We operate advanced equipment such as upward continuous casting systems for oxygen-free copper rods, CNC-controlled pilger mills for seamless tubes, and automated strip rolling lines with real-time thickness monitoring. All products are manufactured to meet ASTM, DIN, and customer-specific standards, with process control at every stage. Our quality assurance includes metallographic analysis, conductivity testing, and surface quality inspection via optical comparators. From raw material to finished product, we ensure consistency, performance, and on-time delivery for industrial and OEM partners globally.
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Copper product packaging
Our copper product packaging always prioritizes safety protection and professional identification. Copper rods and profiles are securely bundled with steel straps and fixed on reinforced wooden pallets, with waterproof and moisture-proof film wrapped around the exterior. Copper tubes are equipped with protective caps on both ends and packaged in custom-designed cartons or wooden crates with internal cushioning materials. Copper plates and strips are interleaved with anti-rust paper and fully encapsulated in steel-edged crates. All packages are affixed with clear product labels, specifications, and moisture-proof tags. For high-purity copper materials or those with special application requirements (such as oxygen-free copper wires and high-end copper strips), we also offer professional nitrogen-filled sealed packaging to ensure complete oxygen isolation during transportation and storage, preventing oxidation and maintaining the optimal performance and surface condition of the materials.
