I. Material Positioning
Oxygen-free copper C10100 is the "performance benchmark" of pure copper materials, with an oxygen content of less than 0.0005% and a purity of up to 99.99%, known for its superb electrical conductivity, ductility and anti-hydrogen embrittlement properties. As a "hidden champion" in the field of electronics, energy and precision manufacturing, its excellent performance promotes the iterative upgrading of 5G communication, new energy equipment and semiconductor technology.
Core Advantages
Ultimate conductivity: conductivity exceeds the national standard of Grade 1 copper, reducing power transmission loss by more than 15%.
Oxygen-free anti-hydrogen embrittlement: Eliminate the risk of brittle cracking under high-temperature hydrogen environment, suitable for vacuum sealing scenarios.
Precision Processing Capability: Super ductility supports 0.01mm grade ultra-thin foil stamping and wire drawing.
Long-life stability: oxidation resistance, creep resistance, 50-year service cycle performance degradation <3%.
Third, the field of application
Electrical and electronics: semiconductor leadframes, 5G base station waveguide, superconducting coils.
New energy equipment: lithium battery lugs, photovoltaic welding tape, hydrogen fuel cell bipolar plate.
Precision instruments: vacuum tube seals, particle gas pedal cavity, medical imaging equipment conductors.
Aerospace: satellite high-frequency cables, rocket engine cooling lines.
Fourth, the market outlook
Technology upgrade dividend: global 5G base station and data center construction speed up, high-end copper demand increased by 12% annually.
Driven by new energy revolution: the amount of copper used in power batteries will exceed 4 million tons in 2030, and C10100 will become a key material.
Semiconductor localization: China's chip industry investment surge, high purity copper foil market compound annual growth rate of 8.3%.
Green Manufacturing Transformation: The construction of low-carbon power grid and hydrogen energy storage and transportation system will promote the penetration rate of oxygen-free copper in the energy chain.
