What is C12000 copper?
Cu-DLP is a phosphorus-deoxidized copper with a limited, medium amount of residual Phosphorus. It has a good electrical conductivity and excellent welding and soldering properties. It can be formed excellent, either hot or cold.
UNS C12000 copper has 95% IACS conductivity, low residual phosphorus, and high embrittlement resistance. It has a good electrical conductivity and excellent welding and soldering properties. It can be formed excellent, either hot or cold.
We provide TP1/C12000 copper pipes
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Copper C12000 Tubes Chemical Composition
| Grade | Cu | Ph |
| C12000 | Including Ag | 0.004 - 0.012 |
Mechanical Properties of TP1 Phosphorus Deoxidized Copper
The main mechanical properties of TP1 phosphorus deoxidized copper are its high tensile strength and good processing performance, especially in welding and cold bending. Its mechanical property parameters are as follows:
Tensile Strength (σb): ≥315 MPa
TP1 copper has high tensile strength and can withstand certain tensile stress without breaking. This makes TP1 copper suitable for applications requiring high mechanical stress.
Sample Size: Nominal outer diameter ≤100 mm
The tensile strength test of TP1 copper is usually performed on the longitudinal mechanical properties of its tubing at room temperature, suitable for material samples with a diameter not exceeding 100 mm.
Physical Properties
|
Property |
Value |
|
Density (g/cm³) |
8.94 |
|
Melting Point (°C) |
1083 |
|
Electrical Conductivity (%IACS) |
98 – 100 |
|
Thermal Conductivity (W/m·K) |
391 (at 20°C) |
Main Application Areas of TP1 Phosphorus Deoxidized Copper
TP1 phosphorus deoxidized copper is widely used in various industries due to its excellent physical and mechanical properties. Major application areas include:
Electrical and Electronic Industry
TP1 copper is widely used in electrical transmission and electronic contact materials, such as wires, cables, joints, and conductive components. Its excellent electrical and thermal conductivity makes TP1 copper an important raw material in electronic and electrical equipment.
Welding Industry
Due to its good weldability, TP1 copper is widely used in welded joints, welding equipment, and electrical equipment. TP1 copper ensures weld quality and improves contact stability.
Telecommunications Industry
TP1 copper's conductivity and processability make it an important material in the telecommunications industry, especially in equipment that needs to carry signals and current for extended periods.
Automotive and Aerospace Industry
TP1 copper's corrosion resistance and processability make it suitable for use in the automotive and aerospace industries, particularly for manufacturing wear-resistant and corrosion-resistant components.
Other Industrial Equipment
Due to its high strength and excellent corrosion resistance, TP1 copper is also used in various industrial equipment, such as heating equipment and refrigeration systems.
C12000 vs C10200
| Feature | UNS C12000 | UNS C10200 |
|---|---|---|
| Common Name | Phosphorus Deoxidized, Low Residual P (DLP) | Oxygen-Free Copper (OF) |
| Key Composition | Cu ≥99.90%, P: 0.004-0.012% | Cu ≥99.95%, O ≤0.0005% |
| Oxygen Content | Very Low | Extremely Low (Virtually Zero) |
| Deoxidizer | Phosphorus | None (Process-controlled) |
| Electrical Conductivity | Very High (~100% IACS) | Highest (~101%+ IACS) |
| Thermal Conductivity | Very High | Slightly Higher |
| Formability & Ductility | Excellent | Superior (especially in annealed state) |
| Weldability & Brazability | Excellent (due to P deoxidation) | Excellent (requires inert atmosphere) |
| Resistance to Hydrogen Embrittlement | Poor (in reducing atmospheres) | Very Good (no Cu₂O to react) |
| Typical Applications | High-conductivity busbars, heat exchangers, tubing | High-vacuum electronics, glass-metal seals, waveguides, sputtering targets |
Choose C10200 (Oxygen-Free Copper) when your priority is:
Maximum Purity & Conductivity: For critical electrical/electronic components (e.g., waveguides, semiconductor parts).
High-Temperature in Hydrogen: For service in reducing atmospheres (e.g., hydrogen furnaces, brazing atmospheres) where hydrogen embrittlement is a risk.
Superior Ductility & Forming: For severe cold working and deep drawing applications.
High-Vacuum or Sealing Applications: Where outgassing or oxidation at high temperatures must be absolutely minimized (e.g., glass-metal seals, accelerator parts).
Choose C12000 (Phosphorus Deoxidized Copper) when your priority is:
Excellent Conductivity at Lower Cost: For high-performance busbars, electrical conductors, and heat exchangers where C10200's marginal gain isn't justified.
Easier Joining in Air: Its deoxidized nature makes it very forgiving for welding and brazing in standard shop environments.
General High-Conductivity Applications: Where hydrogen embrittlement is not a concern (e.g., standard electrical components, non-reducing atmosphere heat transfer).
Good Balance of Performance and Practical Fabrication.
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Dimensional Range Table
In plumbing and HVAC standards, copper tubing is commonly classified into three main types based on wall thickness: Type K, Type L, and Type M.
Type K: Has the thickest wall. It is the strongest and most durable, primarily used for underground burial, high-pressure applications, and where the highest level of protection is required.
Type L: Has a medium wall thickness. It is the most common and versatile type, widely used for residential and commercial water supply lines (hot and cold) and for many HVAC applications.
Type M: Has the thinnest wall. It is suitable for above-ground, low-pressure residential water supply lines and some drainage applications, offering a cost-effective solution where conditions allow.
The outside diameter (OD) is the same for all three types within a given nominal size. The difference lies in the inner diameter (ID), which decreases as the wall gets thicker.
| Nominal Size (inches) | Type K | Type L | Type M |
|---|---|---|---|
| Outside Diameter (OD) | Same for all types | ||
| Wall Thickness | Thickest | Medium | Thinnest |
| Inside Diameter (ID) | Smallest | Medium | Largest |
| 1/2" | OD: 0.625" ID: 0.527" Wall: 0.049" |
OD: 0.625" ID: 0.545" Wall: 0.040" |
OD: 0.625" ID: 0.569" Wall: 0.028" |
| 3/4" | OD: 0.875" ID: 0.745" Wall: 0.065" |
OD: 0.875" ID: 0.785" Wall: 0.045" |
OD: 0.875" ID: 0.811" Wall: 0.032" |
| 1" | OD: 1.125" ID: 0.995" Wall: 0.065" |
OD: 1.125" ID: 1.025" Wall: 0.050" |
OD: 1.125" ID: 1.055" Wall: 0.035" |
Our factory
Our factory is built for precision and scale in producing copper rods, tubes, plates, bars, wires, and strips. We operate advanced equipment such as upward continuous casting systems for oxygen-free copper rods, CNC-controlled pilger mills for seamless tubes, and automated strip rolling lines with real-time thickness monitoring. All products are manufactured to meet ASTM, DIN, and customer-specific standards, with process control at every stage. Our quality assurance includes metallographic analysis, conductivity testing, and surface quality inspection via optical comparators. From raw material to finished product, we ensure consistency, performance, and on-time delivery for industrial and OEM partners globally.
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Copper product packaging
Our copper product packaging always prioritizes safety protection and professional identification. Copper rods and profiles are securely bundled with steel straps and fixed on reinforced wooden pallets, with waterproof and moisture-proof film wrapped around the exterior. Copper tubes are equipped with protective caps on both ends and packaged in custom-designed cartons or wooden crates with internal cushioning materials. Copper plates and strips are interleaved with anti-rust paper and fully encapsulated in steel-edged crates. All packages are affixed with clear product labels, specifications, and moisture-proof tags. For high-purity copper materials or those with special application requirements (such as oxygen-free copper wires and high-end copper strips), we also offer professional nitrogen-filled sealed packaging to ensure complete oxygen isolation during transportation and storage, preventing oxidation and maintaining the optimal performance and surface condition of the materials.
