Oxygen-free copper OC10300 (C10300) is a high-purity copper material with a copper content of ≥99.95%, with the oxygen content strictly controlled below 0.003%, and oxide inclusions effectively eliminated through the vacuum melting process. With excellent electrical/thermal conductivity and ductility, this material has become a core raw material for precision electronics and high-end power equipment manufacturing.
Production process
Vacuum induction melting → vertical continuous casting → multi-pass cold rolling → protective atmosphere annealing closed-loop production system. The oxygen content is controlled at ≤10ppm throughout the whole process, and the precise grain refinement technology ensures that the material has uniform microstructure and stable physical properties.
Core Characteristics
Excellent conductivity: 102% IACS conductivity, 5-8% higher than ordinary copper.
Excellent processing performance: can withstand more than 90% of the cold deformation, suitable for deep-drawn, spinning and other precision machining.
Strong thermal stability: stable performance from -196°C to 400°C
High surface finish: Ra≤0.2μm, meeting the requirements of vacuum coating substrate.
Excellent welding performance: suitable for laser welding, electron beam welding and other advanced connection processes.
Typical applications
- Semiconductor manufacturing: wafer carrier, sputtering targets
- New energy field: lithium battery lugs, photovoltaic converging band
- RF devices: 5G base station waveguide, coaxial connectors
- Superconducting equipment: low temperature superconducting coil support structure
- Vacuum electronics: magnetron cavity, speed control tube components
Industry Outlook
With the acceleration of 5G communication base station construction (average annual growth rate of 18%), new energy vehicle penetration rate (2025 global demand is expected to reach 1.2 million tons), and semiconductor localization process to promote, high-precision oxygen-free copper demand continues to grow. Superimposed on the carbon neutral policy to promote, OC10300 in the hydrogen fuel cell bipolar plate, superconducting power transmission and other emerging areas of application has great potential, the next five years the market size is expected to maintain 12-15% compound growth. Material R & D is toward nanocrystalline reinforcement (strength increased by 30%), surface composite coating (life extension of 5 times) and other direction breakthroughs, continue to broaden the boundaries of industrial applications.
