C10800 Oxygen Free Copper Details
C10800 oxygen-free copper is a high-purity copper material with a wide range of applications in the fields of electronics, electric power and communications due to its excellent electrical and thermal conductivity and processing performance. The following is a comprehensive introduction of the material characteristics, production process, application areas, market status and future development trends.
I. Material Characteristics
C10800 oxygen-free copper has a copper content of 99.95% or more, with a very low oxygen content (usually less than 0.003%), so it is called "oxygen-free copper". Its main characteristics include:
1. high electrical conductivity: electrical conductivity up to 101% IACS (International Annealed Copper Standard), is the ideal material for power transmission and electronic components.
2. excellent thermal conductivity: thermal conductivity of 398 W/(m-K), suitable for radiators, heat exchangers and other scenarios.
3. Good processing performance: easy to draw, roll and forge, can be made into very fine wires or complex shaped parts.
4. Corrosion resistance: good corrosion resistance to atmosphere, water and non-oxidizing acids at room temperature.
5. No hydrogen embrittlement: avoid the brittleness problem caused by hydrogen residue in ordinary copper.
Second, the production process
The production of C10800 oxygen-free copper is subject to strict process control:
1. Raw material selection: Electrolytic copper plate (copper content ≥ 99.99%) is used as raw material.
2. Smelting process:
Smelting in a vacuum or protective gas (such as nitrogen) environment to prevent oxidization
Adopt the upper lead continuous casting method or horizontal continuous casting technology
3. Deoxidizing treatment:
Add phosphorus copper alloy (such as CuP14) as deoxidizer
Ensure uniform composition by electromagnetic stirring
4. Subsequent processing:
Hot rolling: Heating the ingot to 850-900°C and rolling it.
Cold rolling: multiple passes to achieve target thicknesses
Annealing: Bright annealing at 600-700°C.
Three, application areas
1. electronics industry:
Integrated circuit leadframes
High-end connectors (such as 5G base station RF connectors)
Vacuum electronic devices (traveling wave tube, magnetron, etc.)
2. Power equipment:
Stabilizing layer materials for superconducting cables
Transformer windings
High-voltage switch contacts
3. New energy field:
Tin-coated copper strips for photovoltaic power generation
Power battery lugs for electric vehicles
4. Special applications:
Particle gas pedal vacuum chamber
First wall materials for nuclear fusion devices
Spacecraft wires (e.g., silver-plated copper wires for satellites)
Technical standards and quality control
C10800 needs to comply with a number of international and domestic standards:
1. International standards:
ASTM B170 (American Society for Testing and Materials)
EN 13602 (European standard)
2. Domestic standards:
GB/T 5231-2012 "Processing copper and copper alloy grades and chemical composition".
SJ/T 11483-2014 "Oxygen-free copper and copper alloy rods for electronic devices".
3. Key testing indexes:
Oxygen content: required to be detected by infrared absorption method
Grain size: 0.015-0.025mm is required.
Resistivity: ≤0.01676 Ω-mm²/m at 20℃.
