C10200 oxygen-free copper is a high-purity copper material that occupies an important position in the industrial field with its excellent electrical and thermal conductivity and processing performance. As a high-end product in electrical materials, its oxygen content does not exceed 0.0005%, and at the same time, it has a copper purity of more than 99.95%. These characteristics make it the preferred material in the fields of electric power transmission and electronic components manufacturing. The following is a detailed analysis of the material characteristics, production process, application areas, market status and future development trends.
I. Material properties and standard system
1. Chemical composition and physical properties
C10200 implementation of the ASTM B379 standard, the core features of its very low oxygen content (≤ 50ppm) and trace impurity control (phosphorus ≤ 0.0005%). This tight control allows the material to have:
Electrical conductivity of 101% IACS (International Annealed Copper Standard), superior to ordinary pure copper
Thermal conductivity of 398W/(m-K), close to the theoretical maximum value
Outstanding ductility, cold working elongation of up to 50% or more
Tensile strength 210-240MPa, annealed state hardness HV55-65
2. Comparative advantages with similar materials
Compared with ordinary T2 copper (C11000), oxygen-free copper in high temperature environment will not occur "hydrogen disease" phenomenon - this refers to the oxygen-containing copper in the reducing atmosphere due to the reaction between oxygen and hydrogen to generate water vapor resulting in micro-cracking defects. At the same time, the purity of its grain boundary reduces high-frequency signal transmission loss by more than 30%, which is especially suitable for 5G communication equipment.
Second, the key technology of production process
1. Raw material refining process
Electrolytic refining method is adopted, through three-stage purification treatment:
Primary refining: copper cathode is melted at 1250°C, and nitrogen is introduced to remove impurities such as sulfur and iron.
Vacuum deoxidizing: keep under 10^-3Pa vacuum environment for 2 hours, so that the oxygen content is reduced to below 5ppm.
Continuous casting and rolling: continuous casting by up-induction method, the ingot is hot rolled at 850℃ and then cold rolled to the target thickness.
2. Quality control nodes
Critical control points include:
Melt hydrogen content detection (<1.5ppm required)
On-line oxygen analyzer for real-time monitoring
Grain size inspection (ASTM E112 standard requires grade 6-8)
A leading company in Shanghai adopts GD-MS (Glow Discharge Mass Spectrometry) detection technology, which can reduce the detection limit of impurity elements to ppb level.
Third, the main application areas analyzed
1. Electrical and electronic industry
High-end cables: used in submarine cables (e.g. Huawei marine network project), aerospace wires
Vacuum devices: seals for microwave devices such as magnetrons and speed controllers.
Semiconductor equipment: sputtering targets and lead frames in wafer manufacturing.
2. New energy field
In the photovoltaic industry, C10200 copper tape is used as the conductive substrate of heterojunction cells (HJT), and its surface roughness needs to be controlled at Ra ≤ 0.8 μm. Measured data from a head enterprise shows that the use of oxygen-free copper can increase the conversion efficiency of the battery by 0.3%.
3. Specialty applications
Nuclear fusion device: ITER project selected C10200 as a superconducting magnet stabilization materials
Particle gas pedal: European Center for Nuclear Research (CERN) for high-frequency cavity manufacturing
Six, use and maintenance points
1. Processing Precautions
The annealing temperature should be controlled at 450-550℃ to prevent abnormal grain growth.
Stamping process is recommended to use diamond-coated molds, life can be extended by 5 times.
2. Storage conditions
Relative humidity ≤ 60% of the environment
VCI vapor phase antirust film is recommended for packaging.
With China's "14th Five-Year Plan" to support high-end materials industry, it is expected that by 2026, the domestic market size of oxygen-free copper will exceed 20 billion yuan, and the growth rate of demand in the superconducting power transmission, quantum computing and other emerging areas will maintain an average annual growth rate of more than 18%. The focus of future competition in materials will focus on the two dimensions of nanostructure control and regeneration technology breakthroughs.
