H70 Copper Thin Wire
Henan Gnee New Material Co., Ltd. is one of the most professional manufacturers and suppliers of h70 copper thin wire in China, specialized in providing high quality copper products with competitive price. Welcome to buy discount h70 copper thin wire for sale here from our factory. Customized orders are welcome.
What is H70 Copper Thin Wire?
Our H70 Copper Thin Wire (also known as C26000 or 70/30 Brass) is the professional choice for applications requiring extreme flexibility and precision. As the most ductile grade of the brass family, H70 is specifically refined to allow for the production of ultra-fine wires used in high-tech industries.
The "70/30" ratio creates a single-phase "Alpha Brass" structure, which provides maximum cold-workability. This makes our H70 fine wire indispensable for manufacturing precision electronic connectors, fine-mesh brass filters, and specialized fasteners. Whether in its soft-annealed state for jewelry or hard-drawn for industrial springs, this wire ensures exceptional consistency and a flaw-free surface finish for your production line.
Properties of H70 fine brass wire:
Strength and Plasticity:H70 brass wire has moderate strength and good plasticity. This allows it to meet both strength and processability requirements in many applications.
Conductivity: brass is a good conductive material, so H70 copper wire is often used in the field of electronics, electrical and communications to make conductive parts, such as sockets, connectors and so on.
Corrosion resistance: brass alloys usually have a certain degree of corrosion resistance, which makes H70 brass in some environments can maintain stable performance.
Top quality H70 fine copper wire


Physical Properties of H70 Copper Wire
| Property | Specification |
|---|---|
| Density (g/cm³) | 8.53 |
| Melting Temperature Range (℃) | 915~954 |
| Thermal Conductivity (W/(m·℃)) | 121.4 |
| Specific Heat Capacity (J/(kg·℃)) | 367.8 |
| Linear Coefficient of Thermal Expansion (10^-5/℃) | 19.9 (20~300℃) |
| Electrical Conductivity (%IACS) | 28 |
| Resistivity (μΩ·m) | 0.0616 |
| Tensile Strength & Hardness | Varies based on temper and processing |
| Corrosion Resistance | High in atmospheric, freshwater, and seawater environments |
Chemical Composition
| Element | Content (%) |
| Copper (Cu) | 68.5% - 71.5% |
| Zinc (Zn) | Remainder (Approx. 30%) |
| Lead (Pb) | ≤ 0.03% |
| Iron (Fe) | ≤ 0.10% |
| Total Impurities | < 0.3% |
Electrical & Thermal Properties
| Property | Value |
| Conductivity (IACS) | 27% - 28% |
| Electrical Resistivity | 0.062 Ω·mm²/m |
| Thermal Conductivity | 120 W/(m·K) |
| Density | 8.53 g/cm³ |
Supply Sizes
| Component | Range | Customization |
| Wire Diameter | 0.03mm - 3.0mm | Ultra-fine range available |
| Temper Status | Soft (O), 1/4H, 1/2H, Hard (H) | Tailored Hardness |
| Surface Finish | Bright, Cleaned, or Tinned | Optional |
| Packaging | Precision Spools (Din100-Din250) | Custom Weight per Spool |
Production process of H70 grounding wire
Spanning over 25000 square meters, our state-of-the-art manufacturing facility is equipped with high-precision multi-pass wire drawing machines and atmosphere-controlled annealing furnaces. We specialize in high-purity H70 (C26000), H65, and H62 brass alloys, implementing a rigorous vertical quality control system-from raw material spectrum analysis to final diameter laser measurement-ensuring every spool meets ASTM B134 and international standards.


Why choose our H70 bright bare copper wire
Our Service
1. we can reply your questions within 24 hours (including holidays).
2. 16 years experience in CNC machining.
3. OEM, ODM are welcome, all products can be customized.
4. Protect your personal design and all private information.
5. Provide samples.
6. Welcome to visit.
7. After-sales service.
8. After production and delivery, we will follow up and inform you about your goods in time.
9. After the goods arrive, if you find any design and quality problem or difference with your samples, please feel free to contact us, we will find the problem and solve it with you.

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