C10100 oxygen-free copper and C10200 high-purity copper sheet are the pinnacle of purity and performance in the copper material family.
Both of them realize the ultimate balance of electrical conductivity, processability and environmental adaptability through different, widely used in precision electronics, vacuum devices and high-end manufacturing fields.
C10100 Oxygen Free Copper (OFHC):
With ≥99.99% copper content as the core, the oxygen content is controlled below ≤5ppm and total impurities ≤10ppm through vacuum melting and area melting technology. its conductivity reaches 101%-103% IACS, close to the theoretical limit, making it the preferred material for high frequency inductors, superconducting magnets and vacuum electron tubes. The coefficient of thermal expansion (CTE) is stabilized at 16.8×10-⁶/°C within the temperature zone of -200°C to 400°C. It has excellent matching with ceramics, glass and other materials, and is suitable for microwave device encapsulation in spacecraft. The surface roughness can be processed to Ra 0.01μm, which meets the requirement of nanometer level flatness for photolithography mask plate substrate.
C10200 Deoxidized Copper (DLP):
The oxygen content is reduced to less than 0.003% through phosphorus deoxidation process, while retaining 0.01%-0.04% of phosphorus element, which significantly improves the thermal processing performance under the premise of ensuring electrical conductivity ≥100% IACS. Its softening temperature reaches 350°C, an increase of 50°C compared to C10100, making it suitable for deep stamping molding processes, such as heat exchanger fins (minimum pitch 0.8mm) and honeycomb panels for architectural curtain walls. In seawater environment, phosphorus element forms a dense protective film, and its corrosion resistance is 3 times higher than C10100, making it an ideal material for sacrificial anodes for offshore platforms.
Core performance comparison:
Conductivity: C10100 (101.5% IACS) is slightly better than C10200 (100.2% IACS), but both are far superior to conventional copper violet (98% IACS).
Machinability: C10200 tensile strength (220-250MPa) than C10100 (200-230MPa) 10% higher, elongation (40%-45%) 5% higher, more suitable for complex deformation processing.
Weldability: C10200 phosphorus content inhibits hydrogen embrittlement tendency, laser welding porosity ≤ 0.5%, better than C10100 2%.
Application Scenario:
C10100: Quantum computing superconducting cavity, particle gas pedal waveguide, high-fidelity audio connectors.
C10200: 5G base station heat sink, hydrogen fuel cell bipolar plate, nuclear power steam generator heat transfer tube.
Environmental protection and economy:
The recycling rate of both reaches 99.5%, and the cost per unit mass is 70% lower than that of silver-copper alloy. C10200 reduces refining energy consumption by 20% through phosphorus deoxidation process, and carbon emission is 15% lower than that of C10100, making it a benchmark material for green manufacturing.
To sum up, C10100 and C10200 have redefined the application boundary of high-end copper materials with the trinity of "ultra-purity - extreme performance - environment-friendly", showing irreplaceable value in strategic fields such as quantum technology, new energy and deep-sea engineering, and becoming the core material for promoting industrial civilization to the evolution of precision and cleanliness. Basic material.
