This document establishes requirements for copper sheet, strip, plate, and rolled bar produced from various types of copper, specifying chemical composition limits. It covers copper products made from oxygen-free electronic, oxygen-free, phosphorized, and other types of copper. The document references ASTM standards for testing methods and material specifications.
Standard Specification for Copper Sheet, Strip, Plate, and Rolled Bar
What is C11000 material standard?
C11000 Electrolytic Tough Pitch (ETP) Copper is known for its high electrical and thermal conductivity, good corrosion resistance and solderability. C11000 copper is used for welding fixtures, anodes, bus bar in electrical power installations, ground straps, commutators and current-carrying hardware.
What is the equivalent of C11000?
C11000 is the equivalent of CW004A (EN), C1100 (JIS), and Cu-ETP (ISO). In British Standards, C101 may also refer to this grade depending on context, although it more commonly aligns with oxygen-free variants. Its balance of performance, workability, and cost makes it ideal for general electrical applications.
What is the difference between C11000 and C10100 copper?
Oxygen-free copper is available in the following three grades: C10100 (OFE): 99.99% pure copper with 0.0005% oxygen content. C10200 (OF): 99.95% pure copper with 0.001% oxygen content. C11000 (ETP): 99.9% pure copper with 0.02% to 0.04% oxygen content.
What is the difference between C11000 and C12200?
Strength: Copper C12200 bars have higher tensile strength and yield strength compared to Copper C11000 bars. This makes them more suitable for applications requiring higher mechanical strength, such as fasteners and connectors. Corrosion Resistance: Both Copper C11000 and C12200 bars are highly resistant to corrosion.
Copper C10100 vs C11000 vs C101, What's the Difference?
Technical Comparison
| Feature | C10100 (C101) | C11000 |
|---|---|---|
| Common Name | Oxygen-Free Electronic (OFE) | Electrolytic Tough Pitch (ETP) |
| Purity (Min) | 99.99% | 99.9% |
| Oxygen Content | ~0.0005% (5 ppm) | 0.02% to 0.04% (200–400 ppm) |
| Conductivity | 101% IACS | 100% IACS |
| Welding/Brazing | Excellent; no embrittlement | Susceptible to hydrogen embrittlement |
Key Distinctions
C10100 vs. C101: These are identical. C10100 is the official Unified Numbering System (UNS) designation used in the U.S. and internationally. C101 is the abbreviated trade name or shorthand often used in British Standards.
Purity & Oxygen: C11000 contains a controlled amount of oxygen (cuprous oxide), which is harmless for general use but can cause "hydrogen embrittlement" if the metal is heated above 370°C in a hydrogen-rich atmosphere (e.g., during welding). C10100 is refined in an oxygen-free environment to remove these oxides.
Thermal & Electrical Performance: C10100 offers slightly higher thermal conductivity (up to 400 W/m·K) compared to C11000 (~390 W/m·K). This makes C10100 superior for high-vacuum systems where "outgassing" must be minimized.
Workability: While both are highly ductile, C10100 (OFE) is generally more malleable and easier to draw into extremely fine wire. C11000 is often preferred for volume manufacturing like stamping or deep drawing due to its lower cost and sufficient ductility for most industrial needs.
Why is C11000 prone to hydrogen embrittlement?
A: Trace oxygen reacts with hydrogen in reducing atmospheres, forming water vapor that causes micro-cracks.
How does material C11000 compare to oxygen-free copper (OFHC)?
A: C11000 has slightly lower conductivity (~100% IACS vs. 101% for OFHC) but is more cost-effective for general applications.
Can C11000 be used for welding?
A: Yes, but avoid processes involving hydrogen (e.g., gas welding). Soldering or brazing is preferred.
