Electrolytic Copper Plate
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Electrolytic Copper Plate

Copper plating is also often used as an undercoat to enhance the adhesion of silver, gold or other plating, improve its electrical properties and/or corrosion resistance, and prevent migration of alloying elements into the final plating.
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Product Introduction

Henan Gnee New Material Co., Ltd. is one of the most professional manufacturers and suppliers of electrolytic copper plate in China, specialized in providing high quality copper products with competitive price. Welcome to buy discount electrolytic copper plate for sale here from our factory. Customized orders are welcome.

 

Copper electroplating is a simple electrochemical process that forms a thin coating on any conductive surface with the aid of an electrolyte bath. The electrolytic process is very simple. The cathode and anode (positive and negative) attract opposite charges from the electrolyte and anode.

In this process, pure copper wire acts as the anode and the product or part to be plated acts as the cathode. The electrolyte completes the circuit and the current allows copper particles to be deposited on the cathode surface.

This seemingly simple setup has huge benefits for multiple industries because it gives you the best of both worlds. You get the corrosion resistance, conductivity and other benefits of copper without sacrificing overall strength.

All steel parts that contain or may contain residual tensile stresses prior to cleaning and plating must be stress relieved at a temperature of at least 375° ±25°F (191° ±14°C) for at least three hours. The temperature and duration of the stress relief treatment must be sufficient to achieve maximum stress relief without reducing the hardness below the specified minimum.

To eliminate hydrogen embrittlement, all steel parts with a tensile strength greater than 210 KS1 plated with military-grade copper must be baked at 375° ±25°F (191° ±14°C) for 24 hours within four hours of plating. Plated springs and other flexible parts should not be bent prior to baking.

To meet military specification standards for copper plating, the coating must adhere to the point where it will not separate from the substrate when examined at 4x magnification. If possible, testing should be done on a workpiece that can be bent to 180°; the test piece must be clamped in a vise and bent repeatedly until the substrate breaks; if adhesion is good, most of the electrolytic copper plating cannot be removed with sharp tools.

Cu (Min)
99%
Shape
Plate
Grade
copper

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