C10100 Copper Rod Can Be Used in A Variety Of Industrial Applications

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Oxygen-free copper (also known as OFC, Cu-OF, Cu-OFE, and oxygen-free high-conductivity copper (OFHC)) is formed by melting copper and combining it with carbon and carbon-containing gases. An electrolytic copper refining process removes most of the oxygen, resulting in a compound composed of 99.95–99.99% copper and less than or equal to 0.0005% oxygen.

Oxygen-free copper materials are classified based on the amount of oxygen removed from the base copper material. The two basic grades are:
Cu-OF (C10200) grade copper is up to 99.95% oxygen-free. This grade of copper has exceptional purity. While no copper is 100% pure, modern technology has enabled refiners to reduce the remaining oxygen content to a practical range of 0.001-0.003%.
Cu-OFE (C10100) grade copper is up to 99.99% oxygen-free. It is purer than Cu-OF, has a slightly higher conductivity percentage (about 1%), and is more corrosion resistant.
Although Cu-OF and Cu-OFE have slightly different compositions due to the 0.04% difference in residual oxygen content, they share many common characteristics. For example, they have the following properties in both soft and hard conditions:
Tensile strength of 222–385 N/mm2
Yield strength range (to 0.1% deformation) of 60–325 N/mm2
Elongation of 60-4%
Hardness range of 45–115 HV
Average electrical conductivity of 102%, guaranteed to be 101% according to IACS
Thermal conductivity ranges between 386–394 W/m°C
Oxygen-free copper (OFC) is formed through an intensive manufacturing and refining process that involves melting the copper and adding gases to the final composition. To prevent the material from deforming and forming cracks, manufacturers can add heat treatments to relieve stress during production. If the OFC does not soften during the heat treatment, manufacturers need to perform further annealing (tempering) operations on the material to strengthen it.
Applications of Oxygen-Free Copper (OFC)
Oxygen-free copper is well suited for a variety of industrial applications, including the manufacture of electronics and products that operate under vacuum conditions.

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